Intel DB85FL User Manual

Technical Reference
57
Table 30 provides maximum case temperatures for the components that are sensitive
to thermal changes. The operating temperature, current load, or operating frequency
could affect case temperatures. Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 30. Thermal Considerations for Components
Component Maximum Case Temperature
Processor For processor case temperature, see processor datasheets and
processor specification updates
Intel B85 Express Chipset 104
o
C
To ensure functionality and reliability, the component is specified for proper operation
when Case Temperature is maintained at or below the maximum temperature listed in
Table 30. This is a requirement for sustained power dissipation equal to Thermal
Design Power (TDP is specified as the maximum sustainable power to be dissipated by
the components). When the component is dissipating less than TDP, the case
temperature should be below the Maximum Case Temperature. The surface
temperature at the geometric center of the component corresponds to Case
Temperature.
It is important to note that the temperature measurement in the system BIOS is a
value reported by embedded thermal sensors in the components and does not directly
correspond to the Maximum Case Temperature.
For information about
Refer to
Processor datasheets and specification updates Section 1.2, page 16
Intel B85 Express Chipset http://www.intel.com/products/desktop/
chipsets/

Intel DB85FL Specifications

General

Form Factor	Micro ATX
Chipset	Intel B85
Socket	LGA 1150
Maximum Memory	32 GB
Memory Type	DDR3
PCI Express x16	1
PCI Express x1	2
PCI Slots	1
SATA Ports	4 x SATA 6Gb/s, 2 x SATA 3Gb/s
RAID Support	RAID 0, 1, 5, 10
Memory Slots	4
Memory Standard	DDR3 1600/1333 MHz
USB Ports	4 x USB 3.0, 8 x USB 2.0
Video Outputs	HDMI, DVI-D, VGA
LAN	Intel I217V
Audio	Realtek ALC892