Intel DH55TC User Manual

Technical Reference
55
Figure 16 shows the locations of the localized high temperature zones.
Item Description
A Processor voltage regulator area
B Processor
C Intel H55 Express Chipset
Figure 16. Localized High Temperature Zones
Table 29 provides maximum case temperatures for the components that are sensitive
to thermal changes. The operating temperature, current load, or operating frequency
could affect case temperatures. Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 29. Thermal Considerations for Components
Component Maximum Case Temperature
Processor For processor case temperature, see processor datasheets and
processor specification updates
Intel H55 Express Chipset 111
o
C

Intel DH55TC Specifications

Add-in Card Connectors

PCI Express 2.0 x16 transfer speed	8 GB/s
PCI Express 2.0 x1 transfer speed	250 MB/s
Conventional PCI connectors count	1

Front Panel USB Headers

USB 2.0 specification compliance	Yes
+5 V DC power on USB headers	Fused
USB Header 2 Pin 10 routing	HDD LED