Intel Desktop Board DH55TC Technical Product Specification
56
To ensure functionality and reliability, the component is specified for proper operation
when Case Temperature is maintained at or below the maximum temperature listed in
Table 29. This is a requirement for sustained power dissipation equal to Thermal
D
esign Power (TDP is specified as the maximum sustainable power to be dissipated by
the components). When the component is dissipating less than TDP, the case
temperature should be below the Maximum Case Temperature. The surface
temperature at the geometric center of the component corresponds to Case
Temperature.
It is important to note that the temperature measurement in the system BIOS is a
value reported by embedded thermal sensors in the components and does not directly
correspond to the Maximum Case Temperature. The upper operating limit when
monitoring this thermal sensor is Tcontrol, as shown in Table 30.
Table 30. Tcontrol Values for Components
Component Tcontrol
Processor For processor case temperature, see processor datasheets and
processor specification updates
Intel H55 Express Chipset 107
o
C
For information about Refer to
Processor datasheets and specification updates Section 1.3, page 14
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