Package Mechanical Specifications
40 Datasheet
3.5 Package Insertion Specifications
The processor can be inserted into and removed from a LGA775 socket 15 times. The
socket should meet the LGA775 requirements detailed in the LGA775 Socket
Mechanical Design Guide.
3.6 Processor Mass Specification
The typical mass of the processor is 21.5 g [0.76 oz]. This mass [weight] includes all
the components that are included in the package.
3.7 Processor Materials
Tab l e 3 - 3 lists some of the package components and associated materials.
3.8 Processor Markings
Figure 3-5 and Figure 3-6 show the topside markings on the processor. This diagram is
to aid in the identification of the processor.
Table 3-3. Processor Materials
Component Material
Integrated Heat Spreader (IHS) Nickel Plated Copper
Substrate Fiber Reinforced Resin
Substrate Lands Gold Plated Copper
Figure 3-5. Processor Top-Side Markings Example (Intel
®
Core™2 Extreme Processor
QX9650)
ATPO
S/N
INTEL ©'06 QX9650
INTEL® CORE™2 EXTREME
SLAN3 XXXX
3.00GHZ/2M/1333/05B
[FPO](e4)
M
e4