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General| Brand | Intel |
|---|---|
| Model | Q9450 - Core 2 Quad Quad-Core Processor |
| Category | Computer Hardware |
| Language | English |
Outlines the purpose and scope of the document for thermal management.
Lists supporting documents and resources for further information.
Provides definitions for key technical terms used in the document.
Details the mechanical specifications for the processor package and its interface.
Covers the thermal limits and specifications for the processor.
Discusses key parameters for designing effective heatsinks.
Addresses chassis thermal design capabilities and improving performance.
Provides guidance on integrating processors into systems.
Defines thermal characterization parameters like Psi (Ψ) for performance assessment.
Describes methods for assessing thermal solution performance using TTV.
Provides guidelines for measuring local ambient temperature (TA).
Details procedures for accurately measuring processor case temperature (TC).
Explains the relationship between frequency, voltage, and power dissipation.
Details the components and functionality of the on-die Thermal Monitor.
Documents requirements for active air-cooled ATX designs using reference solutions.
Presents performance results for reference heatsink designs.
Outlines structural and environmental tests for thermal solutions.
Details safety standards for heatsink and attachment assemblies.
Specifies keep-out and height restrictions for ATX/µATX motherboard designs.
Describes the structural design strategy for heatsink attachment.
Explains the objective and algorithm for minimizing system acoustics.
Details the hardware configuration for implementing Intel QST.
Outlines the initial configuration and tuning process for Intel QST.
Describes the tandem operation of fan thermistors and Intel QST.
Discusses heatsink clip load for mechanical and thermal performance.
Provides guidance on heatsink preload metrics for non-reference designs.
Offers guidelines for selecting heatsinks based on board deflection.
Introduces procedures for measuring heatsink/clip/fastener load.
Details the preparation steps for heatsink clip load testing.
Provides examples of load measurement procedures.
Addresses managing the gap between IHS and heatsink base for performance.
Discusses the impact of contact area on thermal resistance.
Explains factors affecting interface material performance like thermal resistance.
Defines the procedure for attaching a thermocouple to the IHS for TC measurement.
Lists recommended equipment for thermocouple installation.
Recommends calibration and controls for temperature measurement equipment.
Details cutting a groove in the package IHS for thermocouple routing.
