Introduction
Thermal and Mechanical Design Guidelines 13
The physical dimensions and thermal specifications of the processor that are used in
this document are for illustration only. Refer to the datasheet for the product
dimensions, thermal power dissipation and maximum case temperature. In case of
conflict, the data in the datasheet supersedes any data in this document.
1.2 References
Material and concepts available in the following documents may be beneficial when
reading this document.
Document
Location
Intel
®
Core™2 Extreme Quad-Core processor QX6000
Sequence and Intel
®
Core™2 Quad Processor Q6000
Sequence Datasheet
http://developer.intel.com/desig
n/processor/datashts/315592.ht
m
Intel
®
Core™2 Extreme Processor QX9000 Series and
Intel
®
Core™2 Quad Processor Q9000, Q9000S, Q8000,
and Q8000S
Series Datasheet
http://www.intel.com/design/pr
ocessor/datashts/318726.htm
Intel
®
Core™2 Duo Processor E8000 and E7000 Series and Intel
®
Pentium
®
Dual-Core Processor E5000 Series Thermal and
Mechanical Design Guide
www.intel.com/design/processo
r/designex/318734.htm
LGA775 Socket Mechanical Design Guide
http://developer.intel.com/desig
n/Pentium4/guides/302666.htm
Fan Specification for 4-wire PWM Controlled Fans http://www.formfactors.org/
ATX Thermal Design Suggestions http://www.formfactors.org/
microATX Thermal Design Suggestions http://www.formfactors.org/
Balanced Technology Extended (BTX) System Design Guide http://www.formfactors.org/