Processor Thermal/Mechanical Information
Thermal and Mechanical Design Guidelines 17
2 Processor Thermal/Mechanical
Information
2.1 Mechanical Requirements
2.1.1 Processor Package
The processors covered in the document are in a 775-Land LGA package that
interfaces with the motherboard via a LGA775 socket. Refer to the datasheet for
detailed mechanical specifications.
The processor connects to the motherboard through a land grid array (LGA) surface
mount socket. The socket contains 775 contacts arrayed about a cavity in the center
of the socket with solder balls for surface mounting to the motherboard. The socket is
named LGA775 socket. A description of the socket can be found in the LGA775 Socket
Mechanical Design Guide.
The package includes an integrated heat spreader (IHS) that is shown in Figure 1 for
illu
stration only. Refer to the processor datasheet for further information. In case of
conflict, the package dimensions in the processor datasheet supersedes dimensions
provided in this document.
Figure 1. Package IHS Load Areas
Top Surface of IHS
to install a heatsink
IHS Step
to interface with LGA775
Socket Load Plate
Substrate
Top Surface of IHS
to install a heatsink
IHS Step
to interface with LGA775
Socket Load Plate
Substrate
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