Balanced Technology Extended (BTX) System Thermal Considerations
100 Thermal and Mechanical Design Guidelines
The thermal sensor location and elevation are reflected in the Flotherm thermal model
airflow illustration and pictures (see Figure 56 and Figure 57).The Intel Boxed Boards
in BTX form factor have implemented a System Moni
tor thermal sensor. The following
thermal sensor or its equivalent can be used for this function:
Part Number: C83274-002
BizLink USA Technology, Inc.
44911 Industrial Drive
Fremont, CA 94538 USA
(510)252-0786 phone
(510)252-1178 fax
sales@bizlinktech.com
Part Number: 68801-0170
Molex Incorporated
2222 Wellington Ct.
Lisle, IL 60532
1-800-78MOLEX phone
1-630-969-1352 fax
amerinfo@molex.com
Figure 56. System Airflow Illustration with System Monitor Point Area Identified
OM16791
Power Supply
Unit
Thermal
Module
MCH
Memory
Graphics
Add-In Card
Monitor Point
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