Case Temperature Reference Metrology
96 Thermal and Mechanical Design Guidelines
33. Using a blade, carefully shave any adhesive that is above the IHS surface
(see Figure 53). The preferred method is to shave from the edge to the center of
the IHS.
Note: T
he adhesive shaving step should be performed while the adhesive is partially cured,
but still soft. This will help to keep the adhesive surface flat and smooth with no pits
or voids. If there are voids in the adhesive, refill the voids with adhesive and shave a
second time.
34. Clean IHS surface with IPA and a wipe.
35. Clean the LGA pads with IPA and a wipe.
36. Replace the land side cover on the device.
37. Perform a final continuity test.
38. Wind the thermocouple wire into loops and secure or if provided by the vendor
back onto the plastic roll (see Figure 54).
Figure 54. Finished Thermocouple Installation
39. Place the device in a tray or bag until it’s ready to be used for thermal testing use.
D.6 Thermocouple Wire Management
When installing the processor into the socket, the thermocouple wire should route
under the socket lid, as shown in Figure 55. This will keep the wire from getting
d
amaged or pinched when removing and installing the heatsink.
Note: When thermocouple wires are damaged, the resulting reading maybe wrong. For
example, if there are any cuts into the wires insulation where the wires are pinched
between the heatsink and the socket lid when installing the heatsink, the
thermocouple wires can get in contact at this location. In that case, the reported
temperature would be the point of the heatsink/socket lid area. This temperature is
usually much lower than the temperature at the center of the IHS.
Prior to installing the heatsink, make sure that the thermocouple wires remain below
the IHS top surface, by running a flat blade on top of the IHS for example.
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