Intel Q9450 - Core 2 Quad Quad-Core Processor User Manual

Processor Thermal/Mechanical Information
Thermal and Mechanical Design Guidelines 21
Figure 2. Processor Case Temperature Measurement Location
37.5 mm
Measure T
C
at this point
(geometric center of the package)
37.5 mm
37.5 mm
Measure T
C
at this point
(geometric center of the package)
37.5 mm
2.2.2 Thermal Profile
The Thermal Profile defines the maximum case temperature as a function of processor
power dissipation (refer to the datasheet for further information). The TDP and
Maximum Case Temperature are defined as the maximum values of the thermal
profile. By design the thermal solutions must meet the thermal profile for all system
operating conditions and processor power levels. Refer to the processor datasheet for
further information.
While the thermal profile provides flexibility for ATX /BTX thermal design based on its
intended target thermal environment, thermal solutions that are intended to function
in a multitude of systems and environments need to be designed for the worst-case
thermal environment. The majority of ATX /BTX platforms are targeted to function in
an environment that will have up to a 35 °C ambient temperature external to the
system.
For ATX platforms using the Intel
®
Core™2 Extreme quad-core processor QX6000
series at the 775_CONFIG_05B, an active air-cooled design in a Thermally Advantaged
Chassis, with a fan installed at the top of the heatsink equivalent to the RCFH-4
reference design (see Chapter
5) should be designed to manage the processor TDP at
an inlet temperature of 35 ºC + 4 ºC = 39 ºC.
Note: Refer to Thermally Advantaged Chassis version 1.1 for Thermally Advantaged Chassis
thermal and mechanical requirements.
For ATX platforms using the Intel
®
Core™2 Quad processor Q6000 series at 105 W, an
active air-cooled design in an ATX Chassis, with a fan installed at the top of the
heatsink equivalent to the RCBFH-3 reference design (see the document of Intel
®
Pentium
®
4 Processor on 90 nm Process in the 775-Land LGA Package Thermal and
Mechanical Design Guidelines) should be designed to manage the processor TDP at an
inlet temperature of 35 ºC + 5 ºC = 40 ºC.

Intel Q9450 - Core 2 Quad Quad-Core Processor Specifications

General

Brand	Intel
Model	Q9450 - Core 2 Quad Quad-Core Processor
Category	Computer Hardware
Language	English