Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines 77
Appendix D Case Temperature
Reference Metrology
D.1 Objective and Scope
This appendix defines a reference procedure for attaching a thermocouple to the IHS
of a 775-land LGA package for T
C
measurement. This procedure takes into account the
specific features of the 775-land LGA package and of the LGA775 socket for which it is
intended. The recommended equipment for the reference thermocouple installation,
including tools and part numbers are also provided. In addition a video Thermocouple
Attach Using Solder – Video CD-ROM is available that shows the process in real time.
D.2 Supporting Test Equipment
To apply the reference thermocouple attach procedure, it is recommended to use the
equipment (or equivalent) given in the following table.
Item Description Part Number
Measurement and Output
Microscope Olympus* Light microscope or equivalent SZ-40
DMM Digital Multi Meter for resistance measurement Fluke 79 Series
Thermal Meter Hand held thermocouple meter Multiple Vendors
Solder Station (see note 1 for ordering information)
Heater Block Heater assembly to reflow solder on IHS 30330
Heater WATLOW120V 150W Firerod 0212G G1A38-
L12
Transformer Superior Powerstat transformer 05F857
Miscellaneous Hardware
Solder Indium Corp. of America
Alloy 57BI / 42SN / 1AG 0.010 Diameter
52124
Flux Indium Corp. of America 5RMA
Loctite* 498
Adhesive
Super glue w/thermal characteristics 49850
Adhesive
Accelerator
Loctite* 7452 for fast glue curing 18490
Kapton* Tape For holding thermocouple in place Not Available
Thermocouple Omega *,36 gauge, “T” Type
(see note 2 for ordering information)
OSK2K1280/5SR
TC-TT-T-36-72
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