Intel® Thermal/Mechanical Reference Design Information
Thermal and Mechanical Design Guidelines 45
The D60188-001 reference design takes advantage of the cost saving for the light
fan/heatsink mass (450g) and the new TIM material (Dow Corning TC-1996 grease). A
bottom view of the copper core applied by this grease is provided in Figure 12.
Figure 12. Bottom View of Copper Core A
pplied by TC-1996 Grease
The ATX motherboard keep-out and the height recommendations defined in
Section
5.6 remain the same for a thermal solution for the processor in the 775-Land
LGA package.
Note: If this fan design is used in your product and you will deliver it to end use customers,
you have the responsibility to determine an adequate level of protection
(e.g., protection barriers, a cage, or an interlock) against contact with the energized
fan by the user during user servicing.
5.2 Validation Results for Reference Design
5.2.1 Heatsink Performance
Table 3 provides the RCFH-4 heatsink performance for the 775_VR_CONFIG 05B
processors. Table 4 provides the D60188-001 heatsink performance for the Intel
®
Core™2 Quad processor Q6000 series at 95 W and Intel
®
Core™2 Quad processor
Q9000 and Q8000 series at 95 W. The results are based on the test procedure
described in Section 5.2.4.
The tables includes a T
A
assumption of 39 °C and 40 °C for the Intel reference thermal
solution at the processor fan heatsink inlet discussed in Section
2.4.1.
Table 3. ATX Reference Heatsink Performance (RCFH-4) for 775_VR_CONFIG 05B
Processors
Processor Target Thermal
Performance, ca
(Mean + 3)
T
A
Assumption
Notes
Intel
®
Core™2 Extreme quad-core
processor QX6000 series at the
775_VR_CONFIG_05B and Intel
®
Core™2
Extreme processor QX9000 series
0.20 C/W T
A
= 39 C 1
NOTES:
1. Performance targets (Ψ ca) as measured with a live processor at TDP.
To Next Page
Loading...
Need help?
General
