Datasheet 5
Figures
2-1 V
CC
Static and Transient Tolerance......................................................................... 24
2-2 V
CC
Overshoot Example Waveform......................................................................... 25
2-3 Differential Clock Waveform .................................................................................. 34
2-4 Measurement Points for Differential Clock Waveforms............................................... 34
3-1 Processor Package Assembly Sketch....................................................................... 35
3-2 Processor Package Drawing (Sheet 1 of 3) .............................................................. 36
3-3 Processor Package Drawing (Sheet 2 of 3) .............................................................. 37
3-4 Processor Package Drawing (Sheet 3 of 3) .............................................................. 38
3-5 Processor Top-Side Markings Example (Intel
®
Core™2 Extreme Processor QX9650)...... 40
3-6 Processor Top-Side Markings Example (Intel
®
Core™2 Quad Processor Q9000 Series) .. 41
3-7 Processor Land Coordinates and Quadrants, Top View............................................... 42
4-1 land-out Diagram (Top View – Left Side)................................................................. 44
4-2 land-out Diagram (Top View – Right Side)............................................................... 45
5-1 Intel
®
Core™2 Extreme Processor QX9770 Thermal Profile........................................ 78
5-2 Intel
®
Core™2 Extreme Processor QX9650 Thermal Profile........................................ 79
5-3 Intel
®
Core™2 Quad Processor Q9000 and Q8000 Series Thermal Profile .................... 80
5-4 Intel
®
Core™2 Quad Processor Q9000S and Q8000S Series Thermal Profile................. 81
5-5 Case Temperature (TC) Measurement Location ........................................................ 82
5-6 Thermal Monitor 2 Frequency and Voltage Ordering.................................................. 84
5-7 Conceptual Fan Control Diagram on PECI-Based Platforms ........................................ 86
6-1 Processor Low Power State Machine ....................................................................... 90
7-1 Mechanical Representation of the Boxed Processor ................................................... 95
7-2 Space Requirements for the Boxed Processor (side view) .......................................... 96
7-3 Space Requirements for the Boxed Processor (top view) ........................................... 96
7-4 Space Requirements for the Boxed Processor (overall view) ...................................... 97
7-5 Boxed Processor Fan Heatsink Power Cable Connector Description.............................. 98
7-6 Baseboard Power Header Placement Relative to Processor Socket............................... 98
7-7 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view) ............... 99
7-8 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 2 view) ............... 99
7-9 Boxed Processor Fan Heatsink Set Points .............................................................. 100
7-10 Space Requirements for the Boxed Processor (side view) ........................................ 102
7-11 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view) ............. 102
7-12 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 2 view) ............. 103