1-14 (No.MB177)
3.2.2 Removing the thermal SW 2 board
(See Fig.4)
• Prior to performing the following procedure, remove the relay
board and the each amp. board of Lch, Cch, SL/SRch, Rch.
(1) From the top side of the amp. assembly, remove the screw
B attaching the thermal SW 2 board.
3.2.3 Removing the heat sink
(See Figs.4 to 6)
• Prior to performing the following procedure, remove the relay
board and the each amp. board of Lch, Cch, SL/SRch, Rch.
(1) From the both sides of the amp. assembly, remove the
eight screws C attaching the heat sink. (See fig.4)
(2) From the top side of the amp. assembly, remove the eight
screws D attaching the power ICs. (See fig.5)
(3) From the bottom side of the amp. assembly, remove the
twenty screws D attaching the power ICs. (See fig.6)
Fig.4
Fig.5
Fig.6
B
Heat sink
Thermal SW 2 board
C(both sides) C(both sides)
Heat sink
D D
Heat sink
D D
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