P1A
T1A
GEB10283A2
R933
C939
R932
R931
R935
R936
R937
C935
PbF
MARK
UL
C936
C934
C938
C937
R938
<Sub board (for Except KD-R35E,35EY,38EE,411E,411EY,411EU,412E,412EY,412EU,417EE,KD-R416SUN,R419UR)>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
created date:2010-08-05No.MA465
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