<Sub board (for KD-R35E,35EY,38EE,411E,411EY,411EU,412E,412EY,412EU,417EE)>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
F1A
GEA10283A2
S1A
D930
L931
R934
C933
C940
C932
C931
IC930
C930
created date:2010-08-05No.MA465