Marantz SR5400 - IC Data and Pinouts

43
S-801 Series
SOT-23-5
No. Test item Test Condition Test Time r/n
1 # High Temperature Bias
Ta=125 °C V
DD
=Vabs max.×0.9
1000 h 0/22
2 # Temperature Humidity Bias
Ta=85 °C RH=85 % V
DD
=Vabs max.×0.9
1000 h 0/22
3 # Un-saturated
Pressure Cooker Bias
Ta=125 ˚C RH=85 % P=2×10
5
Pa
V
DD
=Vabs max.×0.9
100 h 0/22
4 # High Temperature Storage Tstg max.=150 °C 1000 h 0/22
5 # Low Temperature Storage Tstg min.=−65 °C 1000 h 0/22
6 # Temperature Cycle
( Gas phase )
Tstg max.=150 °C , Tstg min.=−65 °C ( 30min each ) 200 cycles 0/22
7 # Thermal Shock
( Liquid phase )
Tstg max=150 °C , Tstg min.=−65 °C ( 5min each ) 100 cycles 0/22
8 Solderability T=230 °C ±5 °C 5 s 0/11
9 Lead Strength
(Pull test)
Pull force ; 2.5 N 30 s 0/11
10 Lead Strength
(Bending test)
Load ; 1.25 N
45 degree Bend a lead
Twice 0/11
11 ESD V=±2000 V C=100 pF R =1.5 kΩ
Ref. To V
DD
/ V
SS
( 5 units for each direction )
5 pulses 0/20
12 Latch Up
±100 mA ( V
CLAMP
= Vabs max. ) 10 ms pulse
V
DD
= Vopr max.
1 pulse 0/5
Remark : Vabs max. = Absolute maximum voltage , Vopr max. =Maximum operation voltage
# : Each test designated # is performed after Pre-Treatment finished.
Pre-Treatment consists of High Temperature Storage ,Temperature Humidity
Storage and Soldering Heat. (See the table below.)
Pre Treatment
High Temp.
Storage
Temperature
Humidity Storage
Soldering Heat
Ta=125 ˚C
t=24 h
Ta=85 ˚C
RH=65 %
t=168 h
Solder Dipping
T=260 °C
t=10 s
7. IC DATA
IC29 : S-80145