MEIG SLM770A - Environmental Reliability Requirements

SLM770A Module Hardware Design Manual
MeiG Smart Technology Co., Ltd 77/77
6.4 Environmental Reliability Requirements
Table 37 Environmental reliability requirements
Test item
Test condition
Low temperature
storage test
1) TL (test temperature value) : -45℃ (adjusted according to product
demand)
2) tc (sample recovery time) : 1h
3) Test time: 24H (adjusted according to product demand)
High temperature
storage test
1) TH (test temperature value) : +90℃ (adjusted according to product
demand)
2) tc (sample recovery time) : 1h
3) Test time: 24H (adjusted according to product demand)
Temperature shock test
TH (test temperature value) : +70℃ (according to the actual adjustment)
holding time 30min
2) TL (test temperature value) : -40℃ (according to the actual adjustment)
holding time 30min
3) r (transfer time) : within 20s
4) tc (recovery time) : 2h
5) Number of cycles: 24
High temperature and
high humidity test
1) TH (test temperature value) : +85℃
1) D (test set humidity value) : 85%RH
2) tc (sample recovery time) : 1h
3) Test time: 1000 hours,
Remove the cover, power on, and test
Low temperature
operation test
1) TL (test temperature value) : -40℃ (adjusted according to product
demand)
2) Temperature stabilization time: 24h (adjusted according to product
demand)
High temperature
operating test
1) TH (test temperature value) : +85℃ (adjusted according to product
demand)
2) Temperature stabilization time: 24h (adjusted according to product
demand)
Vibration test
1) Sinusoidal sweep frequency: 5~9Hz, 1.2mm; 9~200Hz; 4m/s2
2) Sweep rate: 1oct/min. Three axes, 5 cycles per axis.
ESD test
1, the module tests the power PAD and a large area in the call state, ESD
meets:
① Contact discharge should pass the test grade of ±4KV and ±5KV
② Air discharge should pass the test grade of ±8KV and ±10KV
2, the module in the shutdown state, test the EVB SIM card, ESD meets:
① Contact discharge should pass the test grade of ±4KV
② Air discharge should pass the test grade of ±8KV