SYN-TECH III P25 PORTABLE RADIO
SERVICE MANUAL
7-7
The RF and Control Board are separated from the RF shields to access the DSP Board. The DSP Board
is separated from RF and Control Board by using tweezers to lift it.
Separated view of the two boards is shown below.
After removing all the boards, an aluminum cover (P/N: 6003-4037-2001) remains as shown below. The
reassembly procedure of PCB assembly must be started with this part.
After disassembly, the heat sink compound on the chassis must be inspected. If needed, clean the heat
sink compound from the chassis and place new heat sink compound on to the surface. Pay particular
attention to point where TX final contacts the chassis.
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