CONFIDENTIAL
2 (29)
NPE-4 6310/NPL-1 6310i Repair Hints
Customer Care Europe, Middle East & Africa Version 3.0 Approved
SCCE Training Group Date 22.04.2003
© NMP 2003
Checked by:
SCCE Training Group
Approved by:
SCCE
General
-How to use this document
Place the colored schematics behind this manual.
Now you are able to follow these specifictions with graphical layouts and it is easier for you to find the components
and measuring points.
-General handling
Be very careful when disassembling the NPE-4/NPL-1 while removing the A-Cover from the Back-Cover.
Refer to disassembling instructions at the service manual of NPE-4/NPL-1.
- Broken balls / underfill, µBGA
All replaceable (not underilled) µBGA components must be renewed after removing.
Reflow with uncontrolled hot air fan is strictly forbidden!
The µBGA must be
soldered with NMP approved µBGA rework machines (e.g. Zevac / OK-Metcal / Martin) only .
Check the soldering points after removing a µBGA. Rework the oxidated solderings (broken balls) carefully by tinplating
these areas with few flux and a hot soldering iron, if it is necessary.
Before placing a new component remove the tin and clean the PCB, e.g. with help of soder wick and flux cleaner such as
“Kontakt LR”. Use only the mmended Fluxtype and an appropriate amount of it – avoid to wning the PCB in flux as this
will result in additional faults!
Also check underfilled parts for broken underfill material below. In this case carefully evaluate possible repair actions as
the phone probably was exposed to strong mechanical stress.
“rework” done with uncontrolled hot air PCB drowned in flux broken underfill of an µBGA part
To Next Page
Loading...
Need help?
General
Weight and Dimensions
