Troubleshooting 625
13. Hot melt material
application problems
(continue@
Problem
Adhesive
Bouncing or
Splashing from
Substrate
Possible Reason
Adhesive too hot
Hydraulic pressure too high
Corrective Action
Decrease channel setpoints as
required
Decrease hydraulic pressure as
required
Refer to
Section 4
Section 4
Adhesive viscosity too low
Decrease temperature slightly, or
change to compatible adhesive with
lower viscosity
Section 4
Adhesive Not
Penetrating
Substrate
Nozzle diameter too small
Adhesive not hot enough
Special coating on substrate
Change to a lamer diameter nozzle
Increase channel setpoints slightly
Section 4
Increase channel setpoints slightly. If Section 4
condition persists, check with
adhesive manufacturer for compatible
adhesive
Not enough adhesive being applied
Use higher flow-rated nozzle,
increase temperature slightly, or
increase hydraulic pressure
Adhesive viscosity too high
Increase temperature slightly, or
change to compatible adhesive with
lower viscosity
Section 4
0 No&on Corporation 1991
All Rights Reserved
P/N 109 701 A
41-23OOSP- l/94
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