A-73E3X-NA
E3X-NA
Note: 1 . indicates a unit that can be cut freely. The unit without the mark cannot be cut freely.
2 . The values of the minimum sensing object for E3X-NA# (V) and E3X-NAG# through-beam models indicate those obtained where the sensing distance and
sensitivity are set to optimum values.
3 .The value of the minimum sensing object for E3X-NA#F through-beam models indicates that obtained at the rated sensing distance with the sensitivity set to
the optimum value.
4 .The size of standard sensing object is the same as the fiber core diameter (lens diameter for models with lens).
5 .The value of the minimum sensing object of the through-beam model assumes that the sensing distance and sensitivity are set to the optimum.
Grooved
Narrow vision field
Features Shape
Compatible
Amplifier
Units (E3X-)
Sensing distance (mm)
(Values in parentheses: when
using the E39-F1 Lens Unit)
Standard object (mm)
Minimum sensing object
(Opaque object) Typical
Model
Permissible
bending
radius
Detection of film
sheet, beam
axis adjust-
ment unneces-
sary, easy
installation
NA#(V)
4.0 mm dia.
(0.1 mm dia.)
E32-G14
25 mm
NAG#
NA#F
4.0 mm dia.
(1.0 mm dia.)
Features Shape
Compatible
Amplifier
Units (E3X-)
Sensing distance (mm)
(Values in parentheses: when
using the E39-F1 Lens Unit)
Standard object (mm)
Minimum sensing object
(Opaque object) Typical
Model
Permissible
bending
radius
Ideal for wafer
detection
NA#(V)
1.7 mm dia.
(0.5 mm dia.)
E32-T22S
10 mm
NA#F
Side-view
Ideal for wafer
NA#(V)
2.0 mm dia.
(0.03 mm dia.)
E32-T24S
NA#F
2.0 mm dia.
(0.5 mm dia.)
Free-cut Free-cut
Free-cut
10
10
10
Free-cut
3-mm dia.
1,000
300
Free-cut
3.5 mm dia.
x 3
700
210
To Next Page
Loading...
