Index 235
Fluid pressure, flow rate .......................................... 44
Fluorescence experiment, typical ...................... 89, 118
Fluorescence measurements .................................. 147
Focusing
adjusting camera parfocality ............................. 147
C-mount or F-mount lenses ............................... 202
spectrograph-detector ........................................ 204
Full Frame CCD
hardware binning ................................................. 65
Full frame readout ................................................... 60
Fuse
replacement ....................................................... 168
requirements ........................................................ 35
G-H
Gate Width and Delay optimization ...................... 138
Gated operation
500 picosecond option ......................................... 91
advantages of ............................................... 81, 107
extended-exposure pulsing .......................... 83, 109
Gen II cabling requirements .................................. 163
Gen III cabling requirements ................................. 163
Grounding and safety (ST-133) ............................... 21
Hamamatsu PL0-01Picosecond Light Source . 83, 113
Hardware binning .................................................... 64
Hardware Setup wizard ........................................... 46
Heat removal block ................................................ 155
High level radiation, definition of ......................... 135
Hose connections ..................................................... 44
Humidity requirement ............................................ 163
I-J
I/O Address conflicts ............................................. 175
IEC Publication 348................................................. 21
IEEE-488 GPIB link .............................................. 197
image intensifier gain .............................................. 68
Inhibiting gating during readout ............................ 139
Installation ............................................................... 33
coolant circulator ................................................. 44
hose connections ................................................. 44
PCI card driver .................................................... 39
tubing................................................................... 44
USB 2.0 driver..................................................... 41
Intensifier
EBI....................................................................... 59
MCP .................................................................... 59
Intensifier alarm
disabling of photocathode and MCP power ...... 141
reason for ........................................................... 141
required response ............................................... 141
Intensifier gain
effect on dark charge ......................................... 147
Interface card
PCI
High Speed PCI .............................................. 39
PCI(Timer) ...................................................... 39
Interface card (cont.)
USB 2.0 ............................................................... 40
Interface Control module ....................................... 156
Interline CCD
DIF capability .................................................... 129
hardware binning ................................................. 66
non-overlapped operation .................................... 62
overlapped operation ........................................... 61
readout rate .......................................................... 63
Internal pulser ........................................................ 188
Interrupt conflicts .................................................. 175
IR blockers............................................................. 148
IR sensitivity .......................................................... 148
ISA HR 320 adapter instructions ........................... 209
ISA HR 640 adapter instructions ........................... 210
ISA serial card
I/O address, DMA channel, and interrupt level . 175
K-L
Kinetics .................................................................. 123
ICCD ................................................................. 121
operation ............................................................ 121
Koehler illumination .............................................. 146
Lasers
free-running ....................................................... 138
jitter ................................................................... 139
overview ............................................................ 138
triggered ............................................................ 139
Lens
depth of field ..................................................... 140
focusing ............................................................. 202
installation and removal .................................... 200
lens coupling effects ............................................ 20
mounting ...................................................... 37, 200
performance considerations ............................... 139
resolution ........................................................... 140
throughput ......................................................... 140
Light throughput in microscopy ............................ 143
Line voltage selection
procedure ........................................................... 168
selector drum ....................................................... 36
M
Main tab page, overview........................................ 194
Main+Burst .............................................................. 87
Maintenance ............................................................ 22
MCP ................................................................... 17, 59
MCP bracket pulsing ......................................... 85, 115
MCP On/Off switch ............................................... 153
Microchannel Plate (MCP) ...................................... 59
Microscope
adapters ............................................................... 37
mounting ............................................................ 143
C-mount ........................................................ 146
F-mount ......................................................... 144