Quectel EC21 Series

LTE Standard Module Series
EC21_Series_Hardware_Design
10
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3.14. Interfaces for WLAN & Bluetooth Applications................................................................................ 58
3.14.1. WLAN Application Interface......................................................................................................61
3.14.2. Bluetooth Application Interface................................................................................................ 61
3.15. ADC Interfaces...................................................................................................................................... 61
3.16. SGMII Interface..................................................................................................................................... 62
3.17. Network Status Indication....................................................................................................................64
3.18. STATUS.................................................................................................................................................. 66
3.19. RI............................................................................................................................................................. 67
3.20. USB_BOOT Interface...........................................................................................................................67
4 RF Specifications............................................................................................................................................. 69
4.1. Cellular Network....................................................................................................................................69
4.1.1. Antenna Interfaces & Frequency Bands................................................................................ 69
4.1.2. Operating Frequency.................................................................................................................69
4.1.3. Tx Power......................................................................................................................................71
4.1.4. Rx Sensitivity...............................................................................................................................71
4.1.5. Reference Design...................................................................................................................... 77
4.2. GNSS......................................................................................................................................................78
4.2.1. Antenna Interface and Frequency Bands.............................................................................. 78
4.2.2. GNSS Performance................................................................................................................... 79
4.2.3. Reference Design...................................................................................................................... 80
4.2.4. Layout Guidelines...................................................................................................................... 80
4.3. RF Routing Guidelines.........................................................................................................................80
4.4. Antenna Design Requirements.......................................................................................................... 83
4.5. RF Connector Recommendation....................................................................................................... 83
5 Electrical Characteristic and Reliability.....................................................................................................86
5.1. Absolute Maximum Ratings................................................................................................................ 86
5.2. Power Supply Ratings..........................................................................................................................87
5.3. Operating and Storage Temperatures...............................................................................................87
5.4. Power Consumption............................................................................................................................. 88
5.5. ESD.......................................................................................................................................................104
5.6. Thermal Dissipation........................................................................................................................... 104
6 Mechanical Information................................................................................................................................107
6.1. Mechanical Dimensions.................................................................................................................... 107
6.2. Recommended Footprint...................................................................................................................109
6.3. Top and Bottom Views....................................................................................................................... 110
7 Storage, Manufacturing and Packaging.................................................................................................. 111
7.1. Storage Conditions............................................................................................................................. 111
7.2. Manufacturing and Soldering............................................................................................................112
7.3. Packaging Specifications.................................................................................................................. 113
7.3.1. Carrier Tape...............................................................................................................................113
7.3.2. Plastic Reel................................................................................................................................114
7.3.3. Packaging Process.................................................................................................................. 115