Quectel EC21 Series User Manual

LTE Standard Module Series
EC21_Series_Hardware_Design
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Table 57: Recommended Thermal Profile Parameters
1. If a conformal coating is necessary for the module, do NOT use any coating material that may
chemically react with the PCB or shielding cover, and prevent the coating material from flowing into
the module.
2. Avoid using ultrasonic technology for module cleaning and soldering since it can damage crystals
inside the module.
3. Due to the complexity of the SMT process, please contact Quectel Technical Supports in advance for
any situation that you are not sure about, or any process (e.g. selective soldering) that is not
mentioned in document [9].
7.3. Packaging Specifications
The module adopts carrier tape packaging and details are as follow:
7.3.1. Carrier Tape
Dimension details are as follow:
Factor Recommendation
Soak Zone
Max slope 1–3 °C/sec
Soak time (between A and B: 150 °C and 200 °C) 70–120 s
Reflow Zone
Max slope 2–3°C/s
Reflow time (D: over 217 °C) 40–70 s
Max temperature 235 °C to 246 °C
Cooling down slope -1.5 to -3 °C/s
Reflow Cycle
Max reflow cycle 1
NOTE

Quectel EC21 Series Specifications

General

Brand	Quectel
Model	EC21 Series
Category	Control Unit
Language	English