Quectel M12

M12 Hardware Design
M12_Hardware_Design_V3.3 - 17 -
3. Application interface
The module is equipped with a 64-pin 1.3mm pitch SMT pad that connects to the cellular
application platform. Sub-interfaces included in these pads are described in detail in the following
chapters:
 Power supply (refer to Section 3.3)
 Serial interfaces (refer to Section 3.8)
 Audio interfaces (refer to Section 3.9)
 SIM interface (refer to Section 3.10)
 SD interface (refer to Section 3.16)
Electrical and mechanical characteristics of the SMT pad are specified in Chapter 5&Chapter6.
3.1. Pins of module
3.1.1. Pin assignment
The following figure shows pin name and assignment of M12.
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