Quectel M12

M12 Hardware Design
M12_Hardware_Design_V3.3 - 6 -
FIGURE 42: REFERENCE CIRCUIT OF THE STATUS ............................................................. 58
FIGURE 43: REFERENCE CIRCUIT OF SD CARD ................................................................... 59
FIGURE 44: REFERENCE CIRCUIT OF RF INTERFACE ......................................................... 61
FIGURE 45: RECOMMENDATION OF RF PAD WELDING ..................................................... 63
FIGURE 46: M12 TOP AND SIDE DIMENSIONS（UNIT: MM） ............................................ 68
FIGURE 47: M12 BOTTOM DIMENSIONS（UNIT: MM） ...................................................... 69
FIGURE 48: PAD BOTTOM DIMENSIONS（UNIT: MM） ...................................................... 69
FIGURE 49: FOOTPRINT OF RECOMMENDATION（UNIT: MM） ...................................... 71
FIGURE 50: TOP VIEW OF THE MODULE ................................................................................ 72
FIGURE 51: BOTTOM VIEW OF THE MODULE ...................................................................... 72
FIGURE 52: RADIO BLOCK STRUCTURE OF CS-1, CS-2 AND CS-3 .................................... 73
FIGURE 53: RADIO BLOCK STRUCTURE OF CS-4 ................................................................ 73
Quectel
Confidential