Sage II - Care and Handling Procedures; Circuit Board Handling; Chip Handling; Disk Drive Handling

SAGE
rr SERVTCE
I"IANUAL
[1.0]
CAPS
AND HANDLING PROCEDURES
III
CARE AND
HANDLING PB.OCEDURES
:
Some
components
lnternal to
the SAGE
are sensltive
Eo
improper handlittg.
Statlc
especially
ls known
to cause
damage
to both CMOS
and
LSI
circults.
Industry
quidelines have been
established
to reduce
static
damage
and should be
followed with
no devlatlon.
This
secEion
gives
the
procedures
SAGE
considers
most
irnportant.
III.OI
CIRCUIT
BOARD HANDTING
:
Clrcuit
boards shall only be
handle<l on
or over
antl-statlc mats.
Users
shall
ALWAYS
be
grounded
Lo the mat.
Circuit
boards shall onlv be
stacked
if a
layer
of
conductive
foam is
placed
between
boards.
Circuit
boards
shall only
be
stacked 8
high.
III.O2
CHIP HANDLING:
Chips
sha1l
ONLY be
handled on anti-static mats
with the user
grounded
to the
nat.
III.O3
DISK DRIVE
IIANDLING
:
Dlsk drives
shall be
grasped
only
from
the front
plastlc
bezel.
Dlsk drives
shal1 be very
gently
handled at all tJ-mes,
Disk drives
shall always be stored on
edge.
Disk drives
shall always
be
stored
with
cardboard
shipping diskette
in
p1
ace
.
Disk
drive
doors shal1
never ever be
closed
without either a
dlskette
or
cardboard
shlpping
diskette
in
place.
Disk drives
sha1l
only be
handled and
placed
on antl-static
mats,
Before touching any disk
drive
the
handler
shall discharge
hlmself
to
the anti-stati-c
mat
first.
trII.04
I,TICROPOLIS
DISK DRIVE HANDTING
:
The MICROPOLIS
disk drlves
are handled
as above with
these
dlfferences:
1.
The door may
be closed with
nothlng ln
the drive.
2.
The
disk
drlves are
shlpped
wlthout a
packing
dlskette.