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SIM800L(MT6261)_Hardware Design_V1.01 5 2016-07-07
7. Manufacturing ................................................................................................... 58
7.1. Top and Bottom View of SIM800L .................................................................................... 58
7.2. Typical Solder Reflow Profile ............................................................................................ 58
7.3. The Moisture Sensitivity Level ........................................................................................... 59
7.4. Baking Requirements .......................................................................................................... 59
8. Appendix ............................................................................................................. 60
I. Related Documents ............................................................................................................. 60
II. Terms and Abbreviations .................................................................................................... 61
III. Safety Caution ..................................................................................................................... 63
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