Sony CDP-X229ES Service Manual

—_
CDP-X229ES
SERVICE
MANUAL
ial
Canadian Model
AEP Mcdel
UK Model
E Model
Model Name Using Similar Mechanism
CD
Mechanism
Type
CDM11K-5BD8B
Base
Unit
Name
BU-5BD8B
SPECIFICATIONS
Compact
disc
player
General
Laser
Semiconductor
laser
Power
requirements
AEP
model:
(A
=
780
nm)
220
—
230V
AC,
50/60
Hz
Emission
duration:
continuous
UK
model:
Laser
output
Max.
44,6
wW
240
V
AC
50/60
Hz
This
output
is
the
value
measured
at
US,
Canadian
model
a
distance
of
about
200
mm
from
the
120
V
AC,
60
Hz
objective
lens
surface
on
the
Optical
E
model:
Pick-up
Block.
110
—
120
or
220
—
240
V
AC
Frequency
response
2
Hz
—
20
kHz
+
0.3
dB
adjustable,
50/60
Hz
Signal
to
noise
ratio
More
than
115dB
=
Power consumption 15W
Harmonie
dstonish
Less
than
0.0029%
Dinioieions
appro
Approx.
430x110x40
mm
(wih/d)
: bs including projections) (17x4 3/8x13 1/2 inches)
Channel
separation
More
than
110
dB
Weight
Approx.
6.4kg
(14
lbs
1.802)
Outputs
LINE
OUT
(FIXED)
(phon
jacks)
Output
level
2V
(at
50
kiloohms)
~
continued
on
next
page
-
Load impedance over 10 kiloohms
LINE
OUT
(VARIABLE)
Output
level
max.
2V
(at
50
kiloohms)
This
Compact
Disc
player
is
(phon
jacks)
Load
impedance
over
50
kiloohms
classified
as
a
CLASS
1
DIGITAL
OUT
(OPTICAL)
Wave
length
660
nm
Fen
oo
LASER
Product.
(optical)
output
connector)
Output
level
—
18
dBm
KLASS
1
LASERAPPARAT
The
CLASS
1
LASER
PROD-
HEADPHONES
Output
level
max.
28
mW
UCT
label
is
located
on
the
(Stereo
phone
jack)
Load
impedance
32
ohms
rear
exterior
COMPACT
DISC
PLAYER

Sony CDP-X229ES Specifications

General

Type	CD Player
Disc format	CD
Frequency response	2 Hz - 20 kHz
Dynamic range	100 dB
Digital outputs	Coaxial, Optical
Line output	2V
Dimensions	430 x 125 x 375mm

Summary

Specifications

Compact Disc Player Performance

Details on laser output, frequency response, S/N ratio, dynamic range, and distortion.

Output and Connectivity

Specifications for LINE OUT, DIGITAL OUT, and HEADPHONE outputs.

General Unit Specifications

Power requirements, dimensions, and weight of the unit.

Safety Warnings and Component Handling

Safety-Related Component Warning

Critical components identified for safe operation and replacement.

Component Handling Precautions

Specific advice for handling safety-critical components.

Safety and Model Information

Safety Check-Out Procedures

Detailed steps for performing safety checks, including leakage tests.

Optical and Laser Safety Precautions

Guidelines for handling the optical pick-up and checking laser diodes safely.

Model Identification and Power Specs

Electrical Block Checking

RF Level Check Procedure

Steps to check the RF signal level using an oscilloscope.

S Curve Check Procedure

Procedure for checking the S-curve waveform symmetry and level.

E-F Balance Check Procedure

Steps to check the E-F balance waveform symmetry.

RF PLL Free-run Frequency Check

Checking Location and Procedure

Identifies test points and outlines the procedure for checking RF PLL frequency.

Diagrams and Layouts

Semiconductor Lead Layouts

Block Diagram Explanation

Printed Wiring Board Layouts

Schematic Diagram

The main schematic diagram of the unit's circuitry.

IC Pin Function Details

Waveform Examples

Exploded Views and Parts Lists

CD Mechanism Assembly Exploded View

Optical Pick-up Block Exploded View

Electrical Parts List

BD Board Components