Sony HCD-EC59 - 2 CH AMP;JACK Boards PCB Layout

HCD-EC59
HCD-EC59
2424
• : Uses unleaded solder.
• See page 15 for Circuit Boards Location.
5-7. PRINTED WIRING BOARDS - 2CH AMP/USB-JACK/JACK Boards -
B
E
B
E
TP101
TP102
TP103
TP104
TP105
TP108
TP109
TP110
TP111
TP112
Q141
Q142
R103
R104
R105
R106
R107
R108
R109
R110
R113
R114
R115
R116
R119
R120
C103
C104
C105
R141
C106
R142
R143
C107
R144
C108
R145
R146
C111
C112
R160
R161
R162
R163
C141
C142
C160
C161
C164
C165
D140
D141
4
5
1
2
15
1
15
A102
JW201
JW202 JW203
JW204
JW205
W102
R111
R112
CN100
C101
C102
C109
C110
C162
C163
IC102
TP559
TP560
TP561
TP562
FB561
FB562
R561R562
C565
14
14
CN560
CN561
C561
JW560
R477
R478
C491
C495
C496
TP491
TP492
TP493
TP494
TP495
TP496
TP497
TP498
1
2
8
9
CN496
JW491
JW492
J491
J492
J
MAIN BOARD
CN633
K
MAIN BOARD
CN603
2CH AMP BOARD
1-882-028-
11
(11)
C
USB BOARD
CN903
1-882-031-
11
(11)
USB-JACK BOARD
PC IN
JACK BOARD
PHONES
N
MAIN BOARD
CN605
1-882-029-
11
(11)
A
B
C
D
1 2 3 4 5
1
IC101 2 (RFOUT)
(CD play mode)
200 mV/DIV, 500 ns/DIV
0.7 to 1.5 Vp-p
2
IC101 us (XOUT)
1 V/DIV, 20 ns/DIV
59.1 ns
2.8 Vp-p
qa
IC901 7 (CF2)
1 V/DIV, 20 ns/DIV
83.3 ns
2.8 Vp-p
ea
IC301 qf (X1A)
1 V/DIV, 20 Ps/DIV
30.8 Ps
3.1 Vp-p
es
IC301 os (X1)
1 V/DIV, 100 ns/DIV
168 ns
3.3 Vp-p
wa
IC801 qh (CLK IN)
200 mV/DIV, 20 Ps/DIV
30.5 Ps
Approx.
304 mVp-p
• Waveforms
– BD74UR Board –
– USB Board –
– MAIN Board –
– PANEL Board –
(Page 22)
(Page 22)
(Page 22)
(Page 20)