Sony HDC1550 - Page 60

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1-52

HDC1000/V2 (J, E)

(AU-298 BOARD (SUFFIX 13-))

Ref. No.

or Q’ty Part No. SP Description

C216 1-125-777-11 s CAP, CHIP CERAMIC 0.1MF B 1005

C217 1-165-989-91 s CAP, CERAMIC 10MF (2012)

C218 1-165-989-91 s CAP, CERAMIC 10MF (2012)

C219 1-115-459-21 s CAP, ELECT 47MF

C220 1-164-882-81 s CAP,CHIP CERAMIC 220PF CH 1005

C221 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005

C222 1-125-777-11 s CAP, CHIP CERAMIC 0.1MF B 1005

C223 1-100-352-91 s CAP, CERAMIC 1MF C (1608)

C224 1-100-352-91 s CAP, CERAMIC 1MF C (1608)

C225 1-127-956-21 s CAP, CHIP FILM 0.1MF (3225)

C227 1-127-692-91 s CAP, CHIP CERAMIC 10MF B 3225

C228 1-127-692-91 s CAP, CHIP CERAMIC 10MF B 3225

C229 1-165-989-91 s CAP, CERAMIC 10MF (2012)

C230 1-165-989-91 s CAP, CERAMIC 10MF (2012)

C231 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)

C232 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)

C233 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225

C234 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225

C235 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225

C236 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225

C237 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225

C238 1-125-777-11 s CAP, CHIP CERAMIC 0.1MF B 1005

C239 1-125-777-11 s CAP, CHIP CERAMIC 0.1MF B 1005

C240 *1 1-100-352-91 s CAP, CERAMIC 1MF C (1608)

*2 1-100-566-91 s CERAMIC CHIP 0.1MF 25V

C241 *1 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225

C242 1-100-352-91 s CAP, CERAMIC 1MF C (1608)

C243 1-119-923-81 s CAP, CERAMIC 0.047MF B 1005

C246 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005

C247 1-125-777-11 s CAP, CHIP CERAMIC 0.1MF B 1005

C248 1-125-777-11 s CAP, CHIP CERAMIC 0.1MF B 1005

C249 1-165-989-91 s CAP, CERAMIC 10MF (2012)

C250 1-165-989-91 s CAP, CERAMIC 10MF (2012)

C252 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225

C253 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225

C254 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225

C255 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225

C256 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005

C257 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005

C258 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005

C259 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005

C260 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225

C261 1-164-882-81 s CAP,CHIP CERAMIC 220PF CH 1005

C262 1-164-882-81 s CAP,CHIP CERAMIC 220PF CH 1005

C301 1-117-145-21 s CAP, ELECT 1MF

C302 1-117-145-21 s CAP, ELECT 1MF

C303 1-164-866-81 s CAP, CHIP CERAMIC 47PF CH 1005

C304 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225

C305 1-164-876-81 s CAP,CHIP CERAMIC 120PF CH 1005

C306 1-125-777-11 s CAP, CHIP CERAMIC 0.1MF B 1005

C307 1-125-777-11 s CAP, CHIP CERAMIC 0.1MF B 1005

C308 1-125-777-11 s CAP, CHIP CERAMIC 0.1MF B 1005

C309 1-164-882-81 s CAP,CHIP CERAMIC 220PF CH 1005

C310 1-125-777-11 s CAP, CHIP CERAMIC 0.1MF B 1005

C311 1-100-352-91 s CAP, CERAMIC 1MF C (1608)

C312 1-100-352-91 s CAP, CERAMIC 1MF C (1608)

C313 1-115-459-21 s CAP, ELECT 47MF

C314 1-164-882-81 s CAP,CHIP CERAMIC 220PF CH 1005

C315 1-127-692-91 s CAP, CHIP CERAMIC 10MF B 3225

(AU-298 BOARD (SUFFIX 13-))

Ref. No.

or Q’ty Part No. SP Description

C316 1-127-692-91 s CAP, CHIP CERAMIC 10MF B 3225

C317 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005

C318 1-164-940-81 s CAP,CHIP CERAMIC 3300PF B 1005

C319 1-164-940-81 s CAP,CHIP CERAMIC 3300PF B 1005

C320 1-165-989-91 s CAP, CERAMIC 10MF (2012)

C321 1-165-989-91 s CAP, CERAMIC 10MF (2012)

C322 1-125-777-11 s CAP, CHIP CERAMIC 0.1MF B 1005

C323 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)

C324 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)

C325 1-165-989-91 s CAP, CERAMIC 10MF (2012)

C326 1-165-989-91 s CAP, CERAMIC 10MF (2012)

C327 1-165-989-91 s CAP, CERAMIC 10MF (2012)

C328 1-165-989-91 s CAP, CERAMIC 10MF (2012)

C329 1-125-777-11 s CAP, CHIP CERAMIC 0.1MF B 1005

C330 1-125-777-11 s CAP, CHIP CERAMIC 0.1MF B 1005

C331 1-127-956-21 s CAP, CHIP FILM 0.1MF (3225)

C332 1-164-935-81 s CAP, CHIP CERAMIC 470PF B 1005

C333 1-164-935-81 s CAP, CHIP CERAMIC 470PF B 1005

C334 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225

C335 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225

C336 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225

C337 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225

C338 1-107-420-21 s CAP, CHIP ELECT 47MF

C340 1-107-420-21 s CAP, CHIP ELECT 47MF

C342 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225

C343 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225

C344 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225

C345 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225

C346 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225

C347 1-125-777-11 s CAP, CHIP CERAMIC 0.1MF B 1005

C349 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005

C350 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005

C351 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005

C352 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005

C353 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225

C354 1-164-882-81 s CAP,CHIP CERAMIC 220PF CH 1005

C355 1-164-882-81 s CAP,CHIP CERAMIC 220PF CH 1005

C401 1-115-339-91 s CAP, CERAMIC 0.1MF B (2012)

C402 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225

C403 *1 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005