To Next PageTo Next Page
Need help?Do you have a question about the Sony MDS-JE480 and is the answer not in the manual?
General| Material | Plastic |
|---|---|
| I/O ports | 1 x Opt. - in |
| Device type | HiFi minidisc player |
| Frequency range | 5 - 20000 Hz |
| Shock resistant memory | 10 s |
| Audio A/D Converter (ADC) | 24 bit |
| Signal-to-Noise Ratio (SNR) | 96 dB |
| Product color | Silver |
| Power requirements | 230 V; 50/60 Hz |
| Power consumption (standby) | 0.5 W |
| Power consumption (typical) | 15 W |
Weight and Dimensions| Weight | 3000 g |
|---|---|
| Dimensions (WxDxH) | 430 x 285 x 95 mm |
Detailed technical specifications of the MD deck.
Technical specifications for the digital optical input.
Technical specifications for the analog output.
General specifications including power and dimensions.
Procedure for checking AC leakage from metal parts.
Precautions for handling the optical pick-up block.
Safety warning regarding laser diode emission checks.
Warnings about incorrect adjustments and component replacement.
Steps to use the self-diagnosis function in error history mode.
How to select different items for error history display.
Description and use of a special jig for checking BD board waveforms.
Steps to record Iop value into non-volatile memory.
Steps to display recorded Iop value from non-volatile memory.
Procedure for forcing a system microprocessor reset.
Steps to enter and use the retry cause display mode.
How to interpret the retry cause display data.
Overview of the main unit with labeled controls and indicators.
Description of the function for each button.
Flowchart outlining the disassembly sequence.
Instructions for removing the upper case.
Instructions for disassembling the front panel section.
Instructions for removing the main board.
Instructions for removing the PT board.
Instructions for removing the mechanism deck.
Instructions for removing the over light head and BD board.
Instructions for disassembling the holder assembly.
Instructions for removing the loading motor assembly.
Instructions for removing the sled motor assembly and slider.
Instructions for removing the optical pick-up.
Instructions for removing the spindle motor assembly.
Precautions before operating the test mode.
Methods for entering and exiting the test mode.
Functions of buttons used in test mode operations.
How to operate continuous playback mode.
How to operate continuous recording mode for self-check.
Displays indicating the current test mode.
How the error rate is displayed, including C and AD values.
How track and sector addresses are displayed.
Interpretation of various display indicators.
Performing automatic self-diagnosis for optical pick-up check.
Procedure for handling nonvolatile memory errors.
Flowchart for checking before replacing optical pick-up parts.
Safety warning for checking laser diode emission.
Precautions for handling optical pick-ups due to static sensitivity.
General precautions before performing electrical adjustments.
How to create and use a continuous recorded disc for checks.
Checking temperature compensation offset.
Procedure for checking laser power output.
Comparing current Iop value with non-volatile memory.
Performing automatic checks on optical pick-up characteristics.
Checking traverse function using oscilloscope.
Checking focus bias and tolerance.
Checking MO and CD error rates during playback.
Checking error rate during self-recording and playback.
Setting adjustment results to initial values.
Steps to record and display Iop information.
Adjusting temperature compensation offset.
Procedure for adjusting laser power.
Adjusting the traverse mechanism.
Saving Iop values to non-volatile memory.
Checking CD error rate.
Checking MO error rate.
Checking focus bias.
Adjusting auto gain control output level for CD and MO.
Diagram showing the location of various circuit boards.
Block diagram of the BD section of the main unit.
Printed wiring board layout for the BD board.
Schematic diagram for the BD section (part 1 of 2).
Schematic diagram for the main section (part 1 of 2).
Schematic diagram for the main section (part 2 of 2).
Printed wiring board layout for the main section.
Printed wiring board layout for the display section.
Printed wiring board layout for the power section.
Schematic diagram for the power section.
Pin function description for IC101 on the BD board.
Pin function description for IC201 on the BD board.
Pin function description for IC201 on the BD board (continued).
Pin function description for IC201 on the BD board (continued).
Pin function description for IC1 on the main board.
Pin function description for IC1 on the main board (continued).
Block diagram for IC101 on the BD board.
Block diagram for IC201 on the BD board.
Block diagram for IC401 on the BD board.
Block diagram for IC803 on the BD board.
Block diagram for IC440 on the main board.
Block diagram for IC500 on the main board.
Exploded view of the chassis section.
Exploded view of the front panel section.
Exploded view of the mechanism section (part 1).
Exploded view of the mechanism section (part 2).
Lists capacitors, coils, semiconductors, and connectors.
Lists diodes, ICs, transistors, and resistors.
Lists switches and lithium battery parts.
Lists ferrite bead parts.
Lists jack parts.
