Sony TC-730 Service Manual

Power Requirements:
Power Consumption:
Track System:
Ree! Size:
Tape Speed:
Recording Time:
(with 1,800 ft. tape)
Frequency Response:
Signal-to-Noise Ratio:
Flutter and Wow:
Harmonic Distortion:
Recording
Bias Frequency:
Inputs:
SPECIFICATIONS
AC 100, 110, 120, 127, 220 or
240 V 50/60 Hz
AC 120W
4—track 2—channel stereo and mono
7° (48 cm) or smaller
7 \/2 ips (19 cm/s), 3 3/4 ips (9.5 cm/s),
1 7/g ips (4.8 cm/s)
Tape speed 4-—track stereo 4—track mono
vd Vo ips 1.5 hrs 3 hrs
(19
cm/s)
3 3/4 ips 3 hrs 6 hrs
(9.5 cm/s)
(with SONY SLH tape)
20 ~ 30,000 Hz at 71/2 ips (19 cm/s)
20 ~ 20,000 Hz at 33/4 ips (9.5 cm/s)
(with standard tape}
20 ~ 25,000 Hz at 71/2 ips (19 cm/s)
20 ~ 17,000 Hz at 34/4 ips (9.5 cm/s)
30 ~ 9,000 Hz at 17/g ips (4.8 cm/s)
56 dB (with SLH tape)
53 dB (with standard tape)
0.06 % at 71/2 ips (19 cm/s)
0.1% at 39/4 ips (9.5 cm/s)
0.2% at1 ’/gips {4.8 cm/s)
1.2%
Approx. 160 kHz
Two MIC Inputs
Impedance
Maximum sensitivity
: low impedance
: —72 dB (0.2 mV)
Outputs:
Maximum
Power Output:
Built-in Speaker:
Semiconductors:
Dimensions:
Weight:
Two AUX Inputs
Impedance
Maximum sensitivity
REC/PB connector
Input impedance
Input level
Two LINE Outputs
Load impedance
Output level
HEADPHONE Output
Load impedance
Output level
REC/PB connector
Output impedance
Output level
Two EXT SPKR
Load impedance
Output level
E Model
STEREO
TAPECORDER
: 100 kQQ
: —22 dB (62 mV)
10kQ
: —33 dB (17.4mvV)
: 100 kQ2
: OdB (0.775 V)
BQ
: —36 dB (12.3 mV)
at LEVEL’*1”
—28 dB (30.8 mV)
at LEVEL’ “2”
: 10kQ2
: OdB (0.775 V)
:8Q
: 17 dB (5.6 V)
3.7 W x 2 with built-in speakers
15 Wx 2 with external speakers
4x6 (10x 15cm) x2
impedance 32 (2
51 transistors, 25 diodes and 1 integrat €d circuit
21 (W) x 19 5/g (H) x 8 15/46" (D)
(533 x 498 x 227 m)
51 Ib 13 oz (23.5 kg)
‘SERVICE MANUAL,

Sony TC-730 Specifications

General

Brand	Sony
Model	TC-730
Category	Measuring Instruments
Language	English

Summary

Sony TC-730 Specifications

Section 1: General Description

1-1. Block Diagram

Overall system overview and signal flow.

1-2. Major Parts Locations

Identifies key components on the unit.

Section 2: Disassembly Procedures

2-1. Cabinet Removal

2-2. Head Deck Removal

Section 3: Adjustment Procedures

3-1. Mechanical Adjustments

Procedures for physical adjustments and alignments.

3-2. Electrical Adjustments

Procedures for electrical calibration and testing.

Section 4: Diagrams

4-1. Schematic Diagrams

Detailed circuit schematics.

4-2. Mounting Diagrams

Diagrams showing component placement on circuit boards.

4-3. Level Diagrams

Diagrams illustrating signal levels during operation.

Section 5: Electrical Parts List

Rec Amp Circuit Parts

Pb Amp Circuit Parts

Sos/Echo Circuit Parts

Bias Osc Circuit Parts

Power Supply Circuit Parts

Mechanical Chassis Circuit Parts

Power Amp Circuit Parts

Section 6: Exploded Views

6-1. Cabinet - Top View

Exploded view of the cabinet assembly (top).

6-2. Head Deck - Top View

Exploded view of the head deck assembly (top).

6-3. Amplifier Chassis Panel - Top View

Exploded view of the amplifier chassis panel (top).

6-4. Amplifier Chassis - Top View -

Exploded view of the amplifier chassis (top).

6-5. Chassis - Top View - (1)

Exploded view of the chassis assembly (top, part 1).

6-6. Chassis - Top View - (2)

Exploded view of the chassis assembly (top, part 2).

6-7. Chassis - Top View - (3)

Exploded view of the chassis assembly (top, part 3).

6-8. Chassis - Bottom View

Exploded view of the chassis assembly (bottom).