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Specifications .........................................................................1
1. GENERAL
Location and Function of Controls.........................................3
2. SERVICE NOTE ........................................................ 4
3. DISASSEMBLY
3-1. Case Assy Removal .........................................................6
3-2. Audio Board Removal .....................................................6
3-3. Cassette lid Assy Removal ..............................................7
3-4. Mechanism Deck Removal .............................................7
4. ADJUSTMENTS
4-1. Mechanical Adjustments .................................................8
4-2. Electrical Adjustments ....................................................8
5. DIAGRAMS
5-1. Explanation of IC Terminals ...........................................9
5-2. Printed Wiring Boards ...................................................12
5-3. Schematic Diagram .......................................................15
6. EXPLODED VIEWS
6-1. Case Section .................................................................. 20
6-2. Audio Board Section .....................................................21
6-3. Mechanism Deck Section (MT-WMEX655-125) .........22
7. ELECTRICAL PARTS LIST .................................. 23
TABLE OF CONTENTS
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270°C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
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