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Supermicro X13SEI-TF - Page 17

Supermicro X13SEI-TF
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17
Chapter 1: Introduction
Note 1: The CPU maximum thermal design power (TDP) is subject to chassis and
heatsink cooling restrictions. For proper thermal management, check the chassis and
heatsink specications for proper CPU TDP sizing.
Note 2: For IPMI conguration instructions, refer to the Embedded IPMI Conguration
User's Guide available at http://www.supermicro.com/support/manuals/.

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