Supermicro X13SRA-TF - Page 15

15
Chapter 1: Introduction
Dimensions
• CEB 12" (L) x 10" (W) (305 mm x 254mm), compatible with E-ATX (13” x 12”)
Note 1: The CPU maximum thermal design power (TDP) is subject to chassis and
heatsink cooling restrictions. For proper thermal management, please check the chas-
sis and heatsink specications.
Note 2: For IPMI conguration instructions, please refer to the Embedded IPMI Con-
guration User's Guide available at https://www.supermicro.com/support/manuals/.
Note 3: For proper BMC conguration, please refer to https://www.supermicro.com/
products/nfo/les/IPMI/Best_Practices_BMC_Security.pdf.