Supermicro X13SRA-TF - Processor and Heatsink Installation

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Chapter 2: Installation
2.2 Processor and Heatsink Installation
The processor (CPU) and processor carrier should be assembled together rst to form
the processor carrier assembly. This will be attached to the heatsink to form the processor
heatsink module (PHM) before being installed into the CPU socket. Before installation, be
sure to perform the following steps below:
• Please carefully follow the instructions given on the previous page to avoid ESD-related
damages.
• Shut down the system and then unplug the AC power cord from all power supplies.
• Check that the plastic protective cover is on the CPU socket and none of the socket pins
are bent. If they are, contact your retailer.
• When handling the processor, avoid touching or placing direct pressure on the LGA lands
(gold contacts). Improper installation or socket misalignment can cause serious damage
to the processor or CPU socket, which may require manufacturer repairs.
• Thermal grease is pre-applied on a new heatsink. No additional thermal grease is needed.
• Refer to the Supermicro website for updates on processor and memory support.
• All graphics in this manual are for illustrations only. Your components may look di󰀨erent.
The Intel Xeon W Processor
Intel Xeon W-3400 series CPU
(112L, XCC)
Intel Xeon W-2400 series CPU
(64L, MCC)
Note: The X13SRA-TF supports two CPU SKUs. Each SKU comes with a specic die
and must use a specic carrier. The Intel Xeon W-2400 series processors come with
High/Medium Core Count (MCC) die and must use the CPU carrier E1B; the Intel Xeon
W-3400 series processors come with Extreme Core Count (XCC) die and must use
the CPU carrier E1A.