Why can't the temperature lock be achieved on my Teledyne PIXIS?
If the temperature lock cannot be achieved or maintained on your Teledyne Digital Camera, the ambient temperature may be greater than +23°C. Cool the camera environment or raise the set temperature.
What causes Teledyne Digital Camera to lose temperature lock?
If the Teledyne Digital Camera loses temperature lock, the internal temperature of the camera is too high. Power down and correct the operating conditions that caused the thermal overload to occur.
Why does the baseline signal suddenly change on my Teledyne PIXIS?
If the baseline signal suddenly changes on your Teledyne Digital Camera, it could be due to excessive humidity in the camera vacuum enclosure. Turn off the camera and contact Teledyne Princeton Instruments Customer Support.
How to fix low coolant in CoolCUBE II of Teledyne PIXIS?
If you observe low coolant or air in the hoses of your CoolCUBE II, and find more than two inches of the coolant line filled with air, unscrew the reservoir cap and add coolant. Make sure there are no leaks or air bubbles in the hoses.
General| Brand | Teledyne |
|---|---|
| Model | PIXIS |
| Category | Digital Camera |
| Language | English |
This manual is for scientists and personnel responsible for PIXIS system installation, setup, configuration, and data acquisition.
Lists related documentation and user manuals for the PIXIS camera system, emphasizing current release references.
Details the structure of the manual, listing all chapters and appendices and their content.
Explains safety symbols like CAUTION!, WARNING!, and RISK OF ELECTRIC SHOCK! for hazard identification.
Provides essential safety information regarding power connection, grounding, and equipment handling.
Outlines precautions to prevent permanent damage to the PIXIS system, focusing on static electricity and environmental factors.
Describes the PIXIS as an integrated system housing electronics for CCD readout and control, with USB 2.0 interface.
Introduces eXcelon technology for CCD/EMCCD sensors, highlighting benefits like improved sensitivity and reduced etaloning.
Details the variety of front- and back-illuminated CCDs offered for PIXIS, emphasizing scientific-grade devices for image fidelity.
Illustrates and describes the connectors on the rear panel of a typical PIXIS camera.
Explains that PIXIS cameras receive power from an external supply and provides important cautions about using correct supplies.
Discusses thermoelectric cooling of CCD arrays via Peltier coolers, circulating air, or coolant to reduce dark current.
Describes the standard cables included with a PIXIS Camera System, such as USB 2.0 and MCX to BNC adapter cables.
Explains the Certificate of Performance, which documents camera assembly, testing, and specific performance data.
States that the PIXIS System User Manual covers installation, configuration, and usage of the PIXIS camera and its components.
Lists and describes available data acquisition software packages like LightField, PICam, SITK, WinX, and PVCAM.
Details optional accessories compatible with PIXIS cameras, including internal shutters and various mount adapters.
Provides instructions for unpacking the PIXIS system, checking for shipping damage, and retaining packing materials.
Instructs users to verify that all required equipment and parts for setting up the PIXIS system have been delivered.
Covers basic maintenance for the PIXIS camera and optical surfaces, and explains the repair process.
Provides step-by-step instructions for installing the LightField data acquisition software on the host computer.
Details the procedure for installing WinView/32 and WinSpec32 data acquisition software, including installation type selection.
Guides users through connecting a liquid-cooled PIXIS to an external CoolCUBEII circulator, including placement and coolant checks.
Provides instructions for installing a lens on a C-mount adapter, including overexposure protection and lens replacement advice.
Details the procedure for installing a lens on an integral F-mount adapter, emphasizing overexposure protection.
Explains how to install the adapter for vertical adjustment, aligning PIXIS kinetics rows with the spectrograph focal plane.
Covers proper mounting of the PIXIS to a spectrograph for focus and includes information on spectrograph adapters.
Details connecting an external shutter to the PIXIS, including warnings about internal shutters and connection procedures.
Provides initial steps for acquiring image and spectroscopic data using WinView/32 and WinSpec/32 for system familiarity.
Guides users through the procedure to acquire image data in WinX, assuming a test target and proper system setup.
Details the procedure for acquiring spectral data with PIXIS on a spectrograph, including light source and shutter setup.
Explains focus and rotation adjustment for spectrographs, covering Teledyne Acton Research and IsoPlane models.
Outlines initial steps for acquiring image and spectroscopic data using LightField for system familiarity.
Explains CCDs as grids of photodiodes storing charge, performing photon transduction, integration, and readout.
Describes how PIXIS uses a mechanical shutter to control CCD exposure and the measurement of exposure time.
Discusses non-shuttered operation for full-frame CCDs, explaining potential smearing and how to control it.
Defines exposure time as the duration between acquisition start and stop commands, controlling signal accumulation.
Explains that lowering CCD temperature generally improves signal quality and how to control it in WinX and LightField.
Defines dark charge as thermally induced charge buildup in the CCD, affecting noise and requiring low temperatures.
Describes saturation and blooming when pixel wells exceed capacity, recommending shorter exposures or signal averaging.
Explains the output amplifier's role in converting charge to electrons/count and the selection of High Capacity or Low Noise amplifiers.
Details controller gain selection for changing the electron-to-ADU relationship, impacting signal digitization and noise.
Covers the ADC's function in converting analog signals to digital data, influenced by bits per pixel and settings.
Discusses dual digitization rates (100 kHz and 2 MHz) for PIXIS cameras, balancing data collection speed with noise performance.
Explains ADC offset as a pre-set baseline adjustment to ensure true signal variation is visible, not user-configurable.
Provides formulas for calculating total time to acquire and readout a full frame, considering readout, exposure, and shutter compensation times.
Details the calculation of CCD readout time based on pixel dimensions, shift times, and digitization times.
Explains hardware binning on the CCD array to improve S/N ratio and reduce readout time, at the expense of resolution.
Discusses software binning as a solution for limitations of hardware binning, allowing more photons to be collected.
Describes how CCDs can be oriented for binning along columns (scan rate) or rows (crosstalk), easily switched by camera rotation.
Covers PIXIS timing modes like Free Run, External Sync, and Continuous Cleans, combined with shutter options.
Explains Fast and Safe modes for data collection synchronization, differing in command frequency and computer intervention.
Details the TTL-compatible logic level output for monitoring camera status and controlling external devices.
Describes Kinetics Mode for time-resolved imaging/spectra acquisition using rapid image exposure and storage.
Introduces Custom Chip and Custom Timing modes for faster data acquisition by redefining the active CCD area or shift time.
Provides information on PIXIS system dimensions and weight, referencing outline drawings for specifics.
Lists optical focal plane distances for various C-mount and F-mount configurations.
Details power supply specifications for PIXIS cameras, including input voltage, current, and output capabilities.
Outlines operating and storage temperature ranges, humidity limits, and temperature stability for PIXIS.
Specifies minimum system requirements for running WinX and LightField software with PIXIS cameras.
Details the procedure for adjusting the focus distance of an adjustable C-mount adapter on PIXIS cameras.
Provides steps to focus an F-mount adapter, not the lens itself, ensuring optimal image sharpness.
Explains lens focusing for F-mount and C-mount lenses, emphasizing using the lens's focusing ring for sharpness.
Provides installation instructions for the flange mount adapter connecting PIXIS to Teledyne Acton Research spectrographs.
Details the installation procedure for the 3.60”/3.88” bolt circle adapter for Teledyne Acton Research spectrographs.
Outlines the installation steps for the C-mount adapter to connect PIXIS to Teledyne Acton Research spectrographs.
Provides installation instructions for the adjustable C- to Spectroscopy-Mount adapter for specific Teledyne Acton Research models.
Details installation for the adjustable C- to Spectroscopy-Mount adapter for SP-2150/SP-2750 spectrographs.
Explains the installation procedure for the flange-mount adapter connecting PIXIS to the IsoPlane SCT-320 spectrograph.
Addresses issues where live data is not displayed in the viewer during acquisition, suggesting filename checks and camera icon clicks.
Explains normal causes for baseline changes (temp, gain, speed) and suggests checking for humidity if changes are unexpected.
Provides basic hardware checks for camera issues, including power, cable security, and shutter operation confirmation.
Troubleshoots communication failures between the camera and host computer, checking USB connections, drivers, and card installation.
Provides a procedure to resolve low coolant or air in hoses issues for the CoolCUBEII circulator.
Offers guidelines for cooling-related problems, such as temperature lock failures and gradual cooling capability deterioration.
Addresses data loss or serial violations potentially caused by enabled computer power saving features.
Explains data overrun errors, often due to undersized DMA buffers, and how to increase buffer size.
Provides actions to resolve data overrun messages, including minimizing background programs and checking USB 2.0 bus limitations.
Covers issues where LightField fails to detect connected devices, suggesting power cycling and checking network ports.
Explains how LightField indicates a device is in use by another instance and how to make it available.
Addresses error messages possibly caused by corrupted PVCAM.INI or incorrect camera startup sequence.
Discusses causes of overexposed or smeared images, often related to shutter malfunction or high exposure rates.
Details program error messages, typically due to data overrun from undersized DMA buffers, and resolution steps.
Troubleshoots serial violation errors, usually related to system power status, communication, or cable connections.
Provides a cross-reference table mapping WinSpec/32 terms to their corresponding terms in LightField.
Offers a cross-reference table mapping LightField terms to their corresponding terms in WinSpec/32.
Outlines Teledyne Princeton Instruments' limited warranties, covering defects in materials and workmanship for original purchasers.
Details the one-year warranty against substantial defects, including repair or replacement terms and customer responsibilities.
Specifies the one-year warranty for refurbished/discontinued products, excluding the CCD imaging device.
Covers the cooling performance over the lifetime of XP style detectors, with specific terms for vacuum chamber components.
Warrants the sealed chamber integrity of products for twelve months, covering parts and labor for seal failures.
Guarantees vacuum integrity for 'Non-XP' detectors for twelve months, covering parts and labor for integrity failures.
Provides a one-year warranty for image intensifier products, excluding damage from phosphor/photocathode burn.
Offers a one-year warranty for X-ray products, excluding CCD imaging device and fiber optic assembly damage due to X-rays.
Warrants manufactured software discs against defects for one year, but not for meeting user requirements or uninterrupted operation.
Advises thorough reading of the manual and consulting it before contacting support for operating difficulties.
Outlines customer responsibilities regarding warranty terms, including proof of purchase, defect notification, and payment.
Provides the manufacturing facility address, phone numbers, and email for technical support and service assistance.
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