Texas Instruments CC2540DK-MINI Software Developers Guide

27
SWRU271H–October 2010–Revised April 2019
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The Bluetooth Low Energy Protocol Stack
Chapter 5
SWRU271H–October 2010–Revised April 2019
The Bluetooth Low Energy Protocol Stack
5.1 Overview
The Bluetooth Low Energy protocol stack is object code in the library files. TI does not provide the
protocol stack source code. TI intends the functionality of these layers to be understood as they interact
directly with the application and profiles.
5.2 Generic Access Profile (GAP)
5.2.1 Overview
The GAP layer of the Bluetooth Low Energy protocol stack defines the behavior of devices performing the
following actions:
• Device discovery
• Link establishment
• Link termination
• Initiation of security features
• Device configuration
For an overview of possible device states, see Figure 5-1.
Figure 5-1. GAP State Diagram

Texas Instruments CC2540DK-MINI Specifications

General

Microcontroller	CC2540
Core Architecture	8051
Core Size	8-bit
Operating Frequency	32 MHz
Flash Memory	256 kB
RAM	8 KB
Wireless Protocol	Bluetooth Low Energy (BLE)
GPIO Pins	21
ADC Resolution	12-bit
ADC Channels	8
Operating Voltage	2 V to 3.6 V
Package / Case	QFN-40
Supplier Device Package	40-QFN (6x6)
Operating Temperature	-40°C to 85°C
Interface Type	I2C, SPI, UART