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Texas Instruments CC2540DK-MINI Software Developers Guide

Texas Instruments CC2540DK-MINI
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Gap Bond Manager (GAPBondMgr)
39
SWRU271HOctober 2010Revised April 2019
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The Bluetooth Low Energy Protocol Stack

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Texas Instruments CC2540DK-MINI Specifications

General IconGeneral
MicrocontrollerCC2540
Core Architecture8051
Core Size8-bit
Operating Frequency32 MHz
Flash Memory256 kB
RAM8 KB
Wireless ProtocolBluetooth Low Energy (BLE)
GPIO Pins21
ADC Resolution12-bit
ADC Channels8
Operating Voltage2 V to 3.6 V
Package / CaseQFN-40
Supplier Device Package40-QFN (6x6)
Operating Temperature-40°C to 85°C
Interface TypeI2C, SPI, UART

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