Texas Instruments DRV8833 - Specifications; Absolute Maximum Ratings; ESD Ratings; Recommended Operating Conditions

DRV8833
www.ti.com SLVSAR1E –JANUARY 2011–REVISED JULY 2015
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
VM Power supply voltage –0.3 11.8 V
Digital input pin voltage –0.5 7 V
xISEN pin voltage –0.3 0.5 V
Peak motor drive output current Internally limited A
T
J
Operating junction temperature –40 150 °C
T
stg
Storage temperature –60 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
(1)
±4000
Electrostatic
V
(ESD)
V
Charged device model (CDM), per JEDEC specification JESD22-C101, all
discharge
±1500
pins
(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
T
A
= 25°C (unless otherwise noted)
MIN NOM MAX UNIT
V
M
Motor power supply voltage range
(1)
2.7 10.8 V
V
DIGIN
Digital input pin voltage range –0.3 5.75 V
I
OUT
RTY package continuous RMS or DC output current per bridge
(2)
1.5 A
(1) R
DS(ON)
increases and maximum output current is reduced at VM supply voltages below 5 V.
(2) V
M
= 5 V, power dissipation and thermal limits must be observed.
6.4 Thermal Information
DRV8833
PWP RTY PW
THERMAL METRIC
(1)
UNIT
(HTSSOP) (WQFN) (TSSOP)
16 PINS 16 PINS 16 PINS
R
θJA
Junction-to-ambient thermal resistance 40.5 37.2 103.1 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 32.9 34.3 38 °C/W
R
θJB
Junction-to-board thermal resistance 28.8 15.3 48.1 °C/W
ψ
JT
Junction-to-top characterization parameter 0.6 0.3 3 °C/W
ψ
JB
Junction-to-board characterization parameter 11.5 15.4 47.5 °C/W
R
θJC(bot)
Junction-to-case (bottom) thermal resistance 4.8 3.5 N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: DRV8833