Texas Instruments M-LVDS - Page 27

Board Layout
3-5
Bill of Materials, Board Layout, and PCB Construction
The bottom layer of the EVM contains bulk and decoupling capacitors to be
placed close to the power and ground pins on the device.
Figure 3−5. Bottom Layer
C9
C8 C7
C5 C4
C3
C10
C6
C2
C1
VCC
GND
VCC01
GND01