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u-blox M8 Series - Contents; Table of Contents

u-blox M8 Series
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000000 NEO-M8L - Hardware integration manual
UBX-16010549 - R08 Contents Page 3 of 28
C1-Public
Contents
Document information ................................................................................................................................ 2
Contents .......................................................................................................................................................... 3
1 Hardware description ........................................................................................................................... 5
1.1 Overview ........................................................................................................................................................ 5
1.2 Configuration ............................................................................................................................................... 5
1.3 Connecting power ....................................................................................................................................... 5
1.3.1 VCC: Main supply voltage ................................................................................................................. 5
1.3.2 V_BCKP: Backup supply voltage ...................................................................................................... 5
1.3.3 VDD_USB: USB interface power supply ......................................................................................... 6
1.3.4 VCC_RF: Output voltage RF ............................................................................................................. 6
1.4 Interfaces ...................................................................................................................................................... 6
1.4.1 UART ..................................................................................................................................................... 6
1.4.2 USB ........................................................................................................................................................ 6
1.4.3 Display Data Channel (DDC) ............................................................................................................. 7
1.4.4 SPI .......................................................................................................................................................... 7
1.4.5 TX Ready signal ................................................................................................................................... 8
1.5 I/O pins ........................................................................................................................................................... 8
1.5.1 RESET_N: Reset input ....................................................................................................................... 8
1.5.2 WHEELTICK: Wheel tick input ......................................................................................................... 8
1.5.3 FWD: Forward/reverse input ............................................................................................................ 8
1.5.4 D_SEL: Interface select ..................................................................................................................... 9
1.5.5 LNA_EN: LNA enable .......................................................................................................................... 9
1.5.6 TIMEPULSE.......................................................................................................................................... 9
1.6 Electromagnetic interference on I/O lines ............................................................................................. 9
2 Design ..................................................................................................................................................... 10
2.1 Pin description ...........................................................................................................................................10
2.1.1 Pin name changes.............................................................................................................................10
2.2 Minimal design...........................................................................................................................................11
2.3 Layout: Footprint and paste mask ........................................................................................................11
2.4 Antenna .......................................................................................................................................................12
2.4.1 Antenna design with passive antenna .........................................................................................12
2.4.2 Active antenna design .....................................................................................................................13
3 Automotive dead reckoning ............................................................................................................ 14
3.1 Implementation .........................................................................................................................................14
3.2 Sensor calibration .....................................................................................................................................14
3.3 Software migration ...................................................................................................................................14
4 Product handling ................................................................................................................................. 15
4.1 Packaging, shipping, storage and moisture preconditioning ..........................................................15
4.2 Soldering .....................................................................................................................................................15
4.3 EOS/ESD/EMI precautions ......................................................................................................................19
4.4 Safety precautions ...................................................................................................................................21

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