MAX-7 / NEO-7 - Hardware Integration Manual
UBX-13003704 - R09 Production Information Contents
Page 6 of 52
7.2.6 Wave soldering............................................................................................................................ 41
7.2.7 Hand soldering ............................................................................................................................ 41
7.2.8 Rework ........................................................................................................................................ 41
7.2.9 Conformal coating ...................................................................................................................... 41
7.2.10 Casting ........................................................................................................................................ 41
7.2.11 Grounding metal covers .............................................................................................................. 41
7.2.12 Use of ultrasonic processes .......................................................................................................... 42
7.3 EOS/ESD/EMI precautions ................................................................................................................... 42
7.3.1 Electrostatic discharge (ESD) ........................................................................................................ 42
7.3.2 ESD handling precautions ............................................................................................................ 42
7.3.3 ESD protection measures ............................................................................................................. 43
7.3.4 Electrical Overstress (EOS) ............................................................................................................ 43
7.3.5 EOS protection measures ............................................................................................................. 43
7.3.6 Electromagnetic interference (EMI) .............................................................................................. 44
7.3.7 Applications with cellular modules .............................................................................................. 45
8 Product testing ........................................................................................................... 47
8.1 u-blox in-series production test ........................................................................................................... 47
8.2 Test parameters for OEM manufacturer .............................................................................................. 47
8.3 System sensitivity test ......................................................................................................................... 47
8.3.1 Guidelines for sensitivity tests ...................................................................................................... 48
8.3.2 ‘Go/No go’ tests for integrated devices ........................................................................................ 48
A Appendix .................................................................................................................... 49
A.1 Abbreviations ..................................................................................................................................... 49
A.2 Design-in recommendations in combination with cellular operation ................................................... 50
Related documents........................................................................................................... 51
Revision history ................................................................................................................ 51
Contact .............................................................................................................................. 52
To Next Page
Loading...
Need help?
General
