MAX-M10M-Integration manual
Care must also be exercised with placing the receiver in proximity to circuitry that can emit heat.
Temperature-sensitive components inside the module, like TCXOs and crystals, are sensitive to
sudden changes in ambient temperature which can adversely impact satellite signal tracking.
Sources can include co-located power devices, cooling fans or thermal conduction via the PCB.
The GND planes can conduct heat to other elements, but they can act as heat dissipators as well.
Increasing the number of GND vias helps to decrease sudden temperature changes.
High temperature drift and air vents can affect the GNSS performance. For best
performance, avoid high temperature drift and air vents near the module.
3.4.1 Package footprint, copper and solder mask
Figure 28 shows the dimensions of the MAX-M10M form factor.
UBX-22038241 - R01
3 Hardware integration Page 70 of 90
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