MAX-M10M-Integration manual
Figure 29: Recommended copper land and solder mask opening for MAX-M10M
To improve the wetting of the half vias, reduce the amount of solder paste under the module and
increase it outside of the module by defining the dimensions of the paste mask to form a T-shape
(or equivalent) extending beyond the copper mask.
Recommended stencil thickness is 150 µm.
Figure 30: Recommended paste mask pattern for MAX-M10M
These are only recommendations and not specifications. The exact geometry, distances,
stencil thicknesses and solder paste volumes must be adapted to the customer's specific
production processes (for example, soldering).
UBX-22038241 - R01
3 Hardware integration Page 72 of 90
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