SARA-G3 and SARA-U2 series - System Integration Manual 
UBX-13000995 - R26    Design-in 
    Page 150 of 217 
  Provide proper parts on each line connected to the  receiver / speaker as noise and EMI improvements, to 
minimize RF coupling, according to EMC requirements of the custom application. 
o  Mount  a  27  pF  bypass  capacitor  (e.g.  Murata  GRM1555C1H270J)  from  each  speaker  line  to  solid 
ground plane (C6 and C7 capacitors in Figure 83). 
  Provide  additional ESD  protection (e.g.  Bourns  CG0402MLE-18G varistor) if the  analog audio  lines will be 
externally  accessible  on  the  application  device,  according  to  the  EMC/ESD  requirements  of  the  custom 
application. Mount the protection close to an accessible point of the line (D1-D4 in Figure 83). 
 
SARA-G340 
SARA-G350
49
MIC_P
R1
R2 R4
44
SPK_P
48
MIC_N
45
SPK_N
R3
C1
46
MIC_BIAS
47
MIC_GND
C2
C3
D3
D1
C6 C7
L2
L1
C5C4
SPK
Speaker 
Connector
J2
Microphone 
Connector
MIC
J1
D4
D2
 
Figure 83: Analog audio interface headset and handset mode application circuit 
Part Number – Manufacturer 
10 µF Capacitor Ceramic X5R 0603 20% 6.3 V 
GRM188R60J106ME47 – Murata 
100 nF Capacitor Ceramic X7R 0402 10% 16 V 
GRM155R71C104KA88 – Murata 
27 pF Capacitor Ceramic C0G 0402 5% 25 V  
GRM1555C1H270JA01 – Murata 
Low Capacitance ESD Protection 
82 nH Multilayer inductor 0402 
(self resonance frequency ~1 GHz) 
2.2 kΩ Electret Microphone 
2.2 kΩ Resistor 0402 5% 0.1 W  
RC0402JR-072K2L – Yageo Phycomp 
Table 54: Example of components for analog audio interface headset and handset mode application circuit 
  If the analog audio interface is not used, the analog audio pins (MIC_BIAS, MIC_GND, MIC_P, MIC_N, 
SPK_P, SPK_N) can be left unconnected on the application board.