UM980 User Manual
18 Packaging UC-00-M32 EN R1.1
In order to prevent falling off during soldering of the module, do not solder it on the
back of the board during design, and it is not recommended to go through
soldering cycle twice.
The setting of soldering temperature depends on many factors of the factory, such
as board type, solder paste type, solder paste thickness etc. Please also refer to the
relevant IPC standards and indicators of solder paste.
Since the lead soldering temperature is relatively low, if using this method, please
give priority to other components on the board.
The opening of the stencil needs to meet your design requirement and comply with
the examine standards. The thickness of the stencil is recommended to be
0.15mm.
5 Packaging
5.1 Label Description
Figure 5-1 Label Description
5.2 Product Packaging
The UM980 module uses carrier tape and reel (suitable for mainstream surface mount
devices), packaged in vacuum-sealed aluminum foil antistatic bags, with a desiccant
inside to prevent moisture. When using reflow soldering process to solder modules,
please strictly comply with IPC standard to conduct temperature and humidity control
on the modules. As packaging materials such as the carrier tape can only withstand the
temperature of 55 degrees Celsius, modules shall be removed from the package during
baking.
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