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VIA Technologies EPIA-ML - Mainboard Specifications

VIA Technologies EPIA-ML
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Chapter 1
2
M
AINBOARD
S
PECIFICATIONS
CPU
VIA C3 / EDEN EBGA Processor (on board)
Enhanced Ball Grid Array Package (EBGA)
Internal L1 128KB and L2 64KB cache memory
Chipset
VIA CLE266 North Bridge
VT8235 South Bridge
Graphics
Integrated UniChrome graphics with MPEG-2 accelerator
Audio
VT1616 six channel AC97 Codec
3 Audio jacks: Line-in, Line-out and Mic-in; switched to 6-
channel output during 6-channel operations with Smart 5.1
Main Memory
1 DDR266 DIMM socket
Up to 1GB memory size
PCI Bus & IDE
1 x PCI slot
2 x UltraDMA 66/100/133 Connector
LAN
VIA VT6103 10/100 Base-T Ethernet PHY
USB
USB v2.0 / v1.1

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